[En] Circuibras – Circuitos Impressos

BRA ESP

Capability

Our processes are certified by ISO 9001 : 2015 Bureau Veritas Certification and UL (Underwriters Laboratories). The printed circuit boards produced by Circuibras strictly follow the customer’s technical specifications. When not specified,  Circuibras follows  the IPC-A-600H (Acceptability of Printed Boards). All boards delivered  are electrically tested.

Features Technical

image-dicaTip ­Questions regarding any technical term? Look it up in Circuibras’ dictionary of technical terms.

 

 

TECHNICAL SPECIFICATIONS
STANDARD
ADVANCED
 
 
 
 
 
 
 
 
 
Number of layers
1-16 layers
> 16 layers
Raw Material
FR4 – Lead Free Compatible
FR4 – Halogen Free
TG
150°C
> 150°C
Types of products
Boards with impedance control, BGA and Fine Pitch Board, HF & RF
HDI
Solder Mask
As IPC SM 840
Available colors
green, blue, black, red, white, others on request
Legend (symbols / silk)
Minimum stroke width: 100um (0.004’)
Minimum height of character: 700µm (0.028′)
Available colors
White, black, yellow, red, others on request
Superficial finishes
HAL Sn/Pb Hot Air Leveling
ENIG Electroless Nickel Immersion Gold – RoHS
OSP Organic Solderability Preservative – RoHS
Other finishes
Peelable (Solder Out)
Plugging vias
Contact with carbon folder
Golden connectors: As IPC 6012 or client’s specification
Electrical test
Flying probe e testing fixture
As IPC 9252 Classe 2 (100% of the boards are tested)
Packaging
Vacuum
Antistatic material
With  silica gel dessicant
20 boards/sub-panel per package
PCI minimum thickness
0.60mm (0.024′)
< 0.60mm (0.024′)
PCI maximum thickness
3.20mm (0.125′)
> 3.20mm (0.125′)
Maximum Area of panels available
1 a 2 layers
340 x 590mm (13.4′ x 23.2′)
On request
445 x 590mm (17.5′ x 23.2′)
520 x 590mm (20.5′ x 23.2′)
3 a 4 layers
435 x 585mm (17.1′ x 23.0′)
510 x 585mm (20.1′ x 23.0′)
> 4 layers
415 x 580mm (16.3′ x 22.8′)
490 x 580mm (19.3′ x 22.8′)
   
 
 
 
 
 
 
 
   
Copper layer
Track
Insulation
Track
Insulation
Smallest track / insulation – External
1/2oz (17.5µm)
100µm ( 0.004′)
100µm (0.004′)
75µm (0.003′)
75µm (0.003′)
1oz (35µm)
125µm ( 0.005′)
125µm (0.005′)
100µm (0.004′)
100µm (0.004′)
2oz (70µm)
175µm ( 0.007′)
175µm (0.007′)
150µm (0.006′)
150µm (0.006′)
3oz (105µm)
225µm (0.009′)
225µm (0.009′)
On request
Smallest Track / insulation – Internal
1/2oz (17.5µm)
75µm (0.003′)
75µm (0.003′)
50µm (0.002′)
50µm (0.002′)
1oz (35µm)
100µm (0.004′)
100µm (0.004′)
75µm (0.003′)
75µm (0.003′)
2oz (70µm)
150µm (0.006′)
150µm (0.006′)
125µm (0.005′)
125µm (0.005′)
3oz (105µm)
188µm (0.0075′)
188µm (0.0075′)
163µm (0.0065′)
163µm (0.0065′)
Copper layer inside the plated holes :
20µm (0.0008′) – IPC Classe 2
>= 25µm (0.0010′) – IPC Classe 3
Minimum ring
100µm (0.004′) with teardrop
100µm (0.004′) without teardrop
Smallest hole diameter
150µm (0.006′)
< 150µm (0.006′)
Drilling tolerance
+/- 100µm (0.004′)
< +/- 100µm (0.004′)
Dimensional tolerance
+/- 200µm a 130µm (0.008′ a 0.005′)
< +/- 130µm (0.005′)
Dimensional tolerance of the tracks :
+/- 20%
+/- 10%
Controlled impedance
+/- 10%
On request
Minimum Thickness Prepreg
78µm (0.003′)
On request
Copper Thickness (external)
1/2oz – 3oz (17.5µm – 105µm)
> 4oz (140µm)
Copper Thickness (internal)
1/2oz – 1oz (17.5µm – 35µm)
> 2oz (70µm)
DAM mininum (solder mask)
 
Color of Solder Mask
 
Green, Red and Blue
White, Yellow and Black
Green, Red and Blue
White, Yellow and Black
 
75µm (0.003′)
125µm (0.005′)
50µm (0.002′)
< 125µm (0.005′)
Aspect ratio
10 : 1
> 10 : 1
Aspect ratio for Blind Via holes
1 : 1
On request
 
 
 
 
 
 
 
 
 
 
 
Board thickness
Alma ( Tolerance ) – Angle of Crease
Fold
>=1.20 – <=2.40mm
0.40mm (+/-0.10mm) – 20° ou 30°
On request
< 1.20 – >=0.50mm
0.30mm (+/-0.10mm) – 20° ou 30°
Flatness, warping and twisting
<= 0,75%
On request
Acceptability criteria
IPC A 600 CLASS 2  or  IPC A 600 CLASS 3