TECHNICAL SPECIFICATIONS
|
STANDARD
|
ADVANCED
|
|
|
|
|
|
|
|
|
|
Number of layers
|
1-16 layers
|
> 16 layers
|
Raw Material
|
FR4 – Lead Free Compatible
|
FR4 – Halogen Free
|
TG
|
150°C
|
> 150°C
|
Types of products
|
Boards with impedance control, BGA and Fine Pitch Board, HF & RF
|
HDI
|
Solder Mask
|
As IPC SM 840
|
Available colors
|
green, blue, black, red, white, others on request
|
Legend (symbols / silk)
|
Minimum stroke width: 100um (0.004’)
|
Minimum height of character: 700µm (0.028′)
|
Available colors
|
White, black, yellow, red, others on request
|
Superficial finishes
|
HAL Sn/Pb Hot Air Leveling
|
ENIG Electroless Nickel Immersion Gold – RoHS
|
OSP Organic Solderability Preservative – RoHS
|
Other finishes
|
Peelable (Solder Out)
|
Plugging vias
|
Contact with carbon folder
|
Golden connectors: As IPC 6012 or client’s specification
|
Electrical test
|
Flying probe e testing fixture
|
As IPC 9252 Classe 2 (100% of the boards are tested)
|
Packaging
|
Vacuum
|
Antistatic material
|
With silica gel dessicant
|
20 boards/sub-panel per package
|
PCI minimum thickness
|
0.60mm (0.024′)
|
< 0.60mm (0.024′)
|
PCI maximum thickness
|
3.20mm (0.125′)
|
> 3.20mm (0.125′)
|
Maximum Area of panels available
|
1 a 2 layers
|
340 x 590mm (13.4′ x 23.2′)
|
On request
|
445 x 590mm (17.5′ x 23.2′)
|
520 x 590mm (20.5′ x 23.2′)
|
3 a 4 layers
|
435 x 585mm (17.1′ x 23.0′)
|
510 x 585mm (20.1′ x 23.0′)
|
> 4 layers
|
415 x 580mm (16.3′ x 22.8′)
|
490 x 580mm (19.3′ x 22.8′)
|
|
|
|
|
|
|
|
|
|
|
|
Copper layer
|
Track
|
Insulation
|
Track
|
Insulation
|
Smallest track / insulation – External
|
1/2oz (17.5µm)
|
100µm ( 0.004′)
|
100µm (0.004′)
|
75µm (0.003′)
|
75µm (0.003′)
|
1oz (35µm)
|
125µm ( 0.005′)
|
125µm (0.005′)
|
100µm (0.004′)
|
100µm (0.004′)
|
2oz (70µm)
|
175µm ( 0.007′)
|
175µm (0.007′)
|
150µm (0.006′)
|
150µm (0.006′)
|
3oz (105µm)
|
225µm (0.009′)
|
225µm (0.009′)
|
On request
|
Smallest Track / insulation – Internal
|
1/2oz (17.5µm)
|
75µm (0.003′)
|
75µm (0.003′)
|
50µm (0.002′)
|
50µm (0.002′)
|
1oz (35µm)
|
100µm (0.004′)
|
100µm (0.004′)
|
75µm (0.003′)
|
75µm (0.003′)
|
2oz (70µm)
|
150µm (0.006′)
|
150µm (0.006′)
|
125µm (0.005′)
|
125µm (0.005′)
|
3oz (105µm)
|
188µm (0.0075′)
|
188µm (0.0075′)
|
163µm (0.0065′)
|
163µm (0.0065′)
|
Copper layer inside the plated holes :
|
20µm (0.0008′) – IPC Classe 2
|
>= 25µm (0.0010′) – IPC Classe 3
|
Minimum ring
|
100µm (0.004′) with teardrop
|
100µm (0.004′) without teardrop
|
Smallest hole diameter
|
150µm (0.006′)
|
< 150µm (0.006′)
|
Drilling tolerance
|
+/- 100µm (0.004′)
|
< +/- 100µm (0.004′)
|
Dimensional tolerance
|
+/- 200µm a 130µm (0.008′ a 0.005′)
|
< +/- 130µm (0.005′)
|
Dimensional tolerance of the tracks :
|
+/- 20%
|
+/- 10%
|
Controlled impedance
|
+/- 10%
|
On request
|
Minimum Thickness Prepreg
|
78µm (0.003′)
|
On request
|
Copper Thickness (external)
|
1/2oz – 3oz (17.5µm – 105µm)
|
> 4oz (140µm)
|
Copper Thickness (internal)
|
1/2oz – 1oz (17.5µm – 35µm)
|
> 2oz (70µm)
|
DAM mininum (solder mask)
|
|
Color of Solder Mask
|
|
Green, Red and Blue
|
White, Yellow and Black
|
Green, Red and Blue
|
White, Yellow and Black
|
|
75µm (0.003′)
|
125µm (0.005′)
|
50µm (0.002′)
|
< 125µm (0.005′)
|
Aspect ratio
|
10 : 1
|
> 10 : 1
|
Aspect ratio for Blind Via holes
|
1 : 1
|
On request
|
|
|
|
|
|
|
|
|
|
|
|
Board thickness
|
Alma ( Tolerance ) – Angle of Crease
|
Fold
|
>=1.20 – <=2.40mm
|
0.40mm (+/-0.10mm) – 20° ou 30°
|
On request
|
< 1.20 – >=0.50mm
|
0.30mm (+/-0.10mm) – 20° ou 30°
|
Flatness, warping and twisting
|
<= 0,75%
|
On request
|
Acceptability criteria
|
IPC A 600 CLASS 2 or IPC A 600 CLASS 3
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|